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High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting

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Product Detail

    Providing with one of the famous high-frequency spindles for wafer dicing or silicon plate cutting brands free sample, Luoyang Bearing Science and Technology Co.,Ltd is one of the best high-frequency spindles for wafer dicing or silicon plate cutting manufacturers and suppliers in China. You can buy customized and low price bulk high-frequency spindles for wafer dicing or silicon plate cutting in stock and check its quotation with our factory.

    High-frequency spindles for cutting performance

    ZYS high-frequency spindles for wafer dicing use air static pressure bearings, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.


    Parameters

    Type

    Speed

    r/min

    KW

    Voltage

    V

    Current

    A

    Frequece

    Hz

    92GD40Q

    40000

    0.75

    220

    2.6

    666

    80GD30Q

    30000

    0.5

    165

    2.5

    500

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Luoyang Bearing Science and Technology Co.,Ltd

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